【Special Use Case】Fine Powder Paste
Introducing fine powder paste.
The particle size of solder powder used in solder paste must be selected appropriately according to the mounted components. As miniaturization of components used in small mounted products progresses, it is necessary to narrow the inner diameter of the metal mask openings and dispensing nozzles to stably apply a small amount of solder to the mounting substrate, which requires the use of fine powders. Fine powders not only have a smaller diameter but also have an increased surface area per unit weight. As a result, issues arise such as: - Decreased wettability - Increased solder balls - Decreased stability during use (continuous application) These challenges necessitate the development of specialized fluxes to address them. We offer a syringe-type solder paste using Type 5 (10-25) powder, which resolves the above issues, and it has already been adopted by our users. *For more details, please feel free to contact us.
- Company：石川金属
- Price：Other
